SEKISUI introduces TIMLIGHT
A new generation of soft, thermally conductive gap pads
SEKISUI introduces TIMLIGHT, a new series of soft, silicone-based thermal interface sheets (“gap pads”) designed to simplify heat management in power electronics while improving handling on the production line.
Covering multiple performance levels and thicknesses to bridge tolerances between heat sources and heat sink, TIMLIGHT gap pads conform to uneven component topographies to efficiently transfer heat into a chassis or heat sink.
They thereby reduce thermal resistance and protect electronics from heat-induced performance loss or even overheating failure.Typical applications include power electronics in automotive and e‑mobility systems, battery, and energy storage solutions, as well as a wide range of industrial electronics where reliable thermal management and long-term stability are crucial.
Thermal conductivity, softness, and customization
Available in multiple performance classes, the TIMLIGHT series covers thermal conductivity levels of 1.5, 3.0 and 5.0 W/m·K, combined with optimized softness (shore 00) to ensure a wide variety of applications can be served.
The material’s low hardness allows it to adapt smoothly to component structures, compensation mechanical gap tolerances while compressed by applying low load for an optimal thermal performance.
Typical thicknesses range from ≈0.5 mm up to ≈5.0 mm with standard increments of 0.5mm, covering both small and large mechanical gaps.
One key advantage: Two layer contruction
A hallmark of the series is an operator‑friendly two‑layer construction: A very soft, self‑tacky base for easy compressibility, paired with a 0.2mm thin, firmer low tack silicone surface layer that makes peel‑off from base liner and apply handling easier for both manual and automated pick-and-place assembly.
With the TIMLIGHT Series, we offer customers a solution that combines reliable thermal performance with the high-quality standards they expect from SEKISUI
TIMLIGHT sheets are electrically insulating by design. When combined with optional insulation films like polyimide (PI), polyethylene (PET), or polyethylene naphthalate (PEN) they can meet strict automotive dielectric requirements suiting applications that require supporting the double layer criteria in harsh mechanical and vibration environments making them safe to use in high‑voltage systems.
TIMLIGHT gap pads also feature a low-outgassing formulation with less than 70 ppm low-molecular siloxanes (D4–D10) and offer a UL94 V-0 equivalent flame rating across a typical operating temperature range of −40 °C to 150 °C.
Supplied as sheets and easily customizable via die cutting, the TIMLIGHT series supports scalable applications ranging from small component pads to large-format solutions for battery modules or busbar cooling. The application was proven successfully in a pilot project where TIMLIGHT gap pads combined with insulation film were applied in an automotive EV busbar application, met strict dielectric requirements and convinced customers to choose SEKISUI.
High quality and reliability
The development of the TIMLIGHT portfolio is guided by SEKISUI’s commitment to quality and continuous improvement. Drawing on the company’s Japanese business philosophy, the products are continuously refined in line with Kaizen principles, incorporating customer feedback and application experience to further enhance performance, reliability, and usability over time.
TIMLIGHT is designed as a continuously evolving portfolio, shaped by application experience and close customer exchange, to ensure consistent quality and long-term reliability across demanding electronics applications.
All products of the portfolio are available now for sampling, quotation and ordering for the global market.